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Home » Fraunhofer IPMS: Lab-to-Fab-Development on 200- and 300-mm-Level

Fraunhofer IPMS: Lab-to-Fab-Development on 200- and 300-mm-Level

Advancements in industry and technology are constantly demanding new solutions for the manufacturing of microchips regarding the technical, economic and also ecological perspective. The Fraunhofer Institute for Photonic Microsystems IPMS has established itself as a strong partner to industry with its pioneering research and state-of-the-art equipment. The range of services includes all steps “from lab to fab” – from consulting and process development to pilot production.

While systems and components have to meet ever higher performance requirements, it is also essential that they are compatible with further industrial processes in the semiconductor industry and comply with the latest technology standards. Easy and fast integration, a wide range of applications and cost efficiency are key parameters. Fraunhofer IPMS is working on innovative solutions in the field of memory technologies, sensors and actuators as well as MEMS systems. With its comprehensive range of services and intensive cooperation with chip manufacturers, system manufacturers and suppliers the institute enables the rapid transfer of results and technologies.

New computing architectures and innovative storage for the next generation of computers
We generate a growing amount of data every day. To deal with this, new technologies are required that enable this information to be stored and processed quickly. With this in mind, Fraunhofer IPMS is researching the next generation of computers. In projects with international partners, such as “QSolid”, “Qu-Pilot” or “QUASAR”, the institute is working on the production of qubits and the construction and architecture of quantum computers. The research focuses on industry-oriented scalability of electronics, optimized materials, processes and control technologies in regard to their CMOS compatibility.

Non-volatile memory (NVM) solutions are becoming increasingly important for modern data processing, as they are more powerful, cost-effective and energy-efficient. Fraunhofer IPMS can look back on more than ten years of experience in the development of MRAM, RRAM and ferroelectric technologies. Of particular note are hafnium oxide-based ferroelectric memories, which can be seamlessly integrated into advanced CMOS technologies, offering significantly better performance and lower cost. Another promising energy-saving while high-performance technology is In-Memory-Computing. Here, data is processed directly at the point of origin, i. e. in the memory arrays. The research services of Fraunhofer IPMS in this area include the development of system designs, circuit designs and integration concepts, as well as material research and characterization up to the megabyte range. With the implementation of materials into production lines using wafer loops, a direct transfer into existing technology nodes can be guaranteed.

Bundled expertise at Semicon Europa
Fraunhofer IPMS will be presenting its latest research results and technical possibilities at “Semicon Europa” from November 12 to 15 in Munich. Visitors will have the opportunity to get in touch with the researchers at the joint Silicon Saxony stand in Hall C1 #419/33. Appointments can be made in advance via the Fraunhofer IPMS website. At the stand, they can also talk to experts from Fraunhofer ENAS, Fraunhofer IZM-ASSID and the Leibniz Institute for Innovative Microelectronics (IHP) – all of which are part of the Research Fab Microelectronics Germany (FMD).